You have reached this page because of your interest in the Microcircuit Memory NSN parts we have available on NSN Domain. Here, you can submit a quote request for Sgs Thompson Microelectronics Inc part number DEL1403N-70LM, a component that can be located by searching for NSN 5962-01-248-5010 in our database. Apart from part number DEL1403N-70LM, we also have an array of others, including military, defense, and aerospace parts that have been sourced from a wide range of trusted manufacturers on our Approved Vendor List (AVL). With this in mind, we invite you to explore our ever-expanding catalogs for in-demand items according to manufacturer, NSN, NIIN, and more.
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NSN Domain works with numerous government and defense agencies, so we take advantage of CAGE Codes like 60911 to uniquely identify items in a standardized manner. Moreover, we organize our stock according to various Federal Supply Classes (FSC), ensuring customers can find Sgs Thompson Microelectronics Inc part number DEL1403N-70LM, which can be found under the FSC 5962 Microcircuits Electronic with ease. On that note, please complete the form below for NSN 5962-01-248-5010 and/or any others so we can see how we can find a solution to your needs. For a hands-on approach, call or email us at any time; our experts are on standby 24/7x365!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-248-5010 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012485010 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
IDT6167L70LB | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.085 INCHES NOMINAL |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | RAM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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